Lawes - Cost Estimate for MEMS
Description
This paper by R.A. Lawes examines the costs of layer deposition of principal high aspect ratio micromachining techniques used in microsystems/ MEMS fabrication, particularly silicon surface micromachining, wet bulk etching, wafer bonding, and other methods using cost model COST-MEMS. Factor explored include: increases in the wafer size, decreases in chip area, and the effect of shipping costs on overall expense.
Credit: [R. A. Lawes] (http://www.imperial.ac.uk/electrical-engineering)
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